The Wedge-Wedge Bonder 5330 can process aluminium and gold wires from 17,5 to 75 µm. Due to the new designed clamp, it’s possible to bond ribbons up to 125µm width. Due to the mechanical manipulator system the operator can create different kind of loops.

   The Wedge-Wedge Bonder 5330 can process aluminium and gold wires from 17,5 to 75 µm. Due to the new designed clamp, it’s possible to bond ribbons up to 125µm width. Due to the mechanical manipulator system the operator can create different kind of loops.
   The bondhead is equipped with automatic feed- and tail-function, which allows optimal, user-friendly bonding. The handling, supported by a colour display and the input with an shuttle-wheel make the programming of the machine very easy. Due to the motor driven Z-axis you work always with repeatable results. Additionally every parameter can be saved to the internal hard disk.

   New bonding wedge has been installed 23.09.2022:

Gaiser 2145-2525-1.0

   New bonding wedge with rounded edges 06.03.2023:

CCLOE-1/16-1"-45-CSF-2025-M