Surface cleaning and activation methods are crucial for preparing surfaces before various processes, such as thin film deposition, bonding, or characterization. These surface cleaning and activation methods help ensure clean, well-prepared surfaces, enabling better adhesion, improved film quality, and accurate characterization in materials science applications. The most common surface cleaning methods include: chemical cleaning, physical cleaning, plasma cleaning, and thermal cleaning. Common activation techniques include plasma activation, chemical treatment, and UV/ozone treatment.
Plasma Ovens (1 pcs)
Plasma cleaning is the removal of impurities and contaminants from surfaces through the use of an energetic plasma or dielectric barrier discharge (DBD) plasma created from gaseous species. Gases such as argon and oxygen, as well as mixtures such as air and hydrogen/nitrogen are used. The plasma is created by using high frequency voltages (typically kHz to >MHz) to ionise the low pressure gas (typically around 1/1000 atmospheric pressure), although atmospheric pressure plasmas are now also common.