Sputtering is a thin film deposition method used in materials science and semiconductor manufacturing. It involves bombarding a target material (often a solid metal or compound) with high-energy ions, typically through a low-pressure gas discharge or plasma. This energetic bombardment dislodges atoms from the target's surface, which then deposit onto a substrate, forming a thin film with precise control over thickness and composition.
| Magnetron sputter system - PHYS NanoSpin |
| Capacity: 1 persons |
Status: Available |
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