Physical vapor deposition (PVD), sometimes (especially in single-crystal growth contexts) called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings. PVD is characterized by a process in which the material goes from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation. PVD is used in the manufacture of items which require thin films for mechanical, optical, chemical or electronic functions. Examples include semiconductor devices such as thin film solar panels, aluminized PET film for food packaging and balloons, and titanium nitride coated cutting tools for metalworking. Besides PVD tools for fabrication, special smaller tools (mainly for scientific purposes) have been developed. Currently this PVD device is dedicated to research of electrochemical thin films sensors.
Kurt J. Lesker Thin Film Deposition System |
Capacity: 1 persons |
Status: Available |
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